Apple and Dell Are Backing Foxconn’s Bid for Toshiba Chip Business
Apple and computing giant Dell will join a Foxconn-led consortium bidding for Toshiba’s highly prized chip unit, the CEO of the world’s largest contract electronics manufacturer told Reuters on Monday.
Terry Gou, Foxconn’s founder and chief executive, said U.S.-based Kingston Technology, a maker of memory products, would also be part of the bidding group, while Amazon.com was close to joining.
He declined to comment on the total size of the offer or say how much Apple and other U.S. firms planned to invest.
“I can tell you Apple is in for sure,” Gou said in an interview, adding that its participation had been approved by the Chief Executive Tim Cook and Apple’s board of directors.
Toshiba is rushing to find a buyer for the world’s second-largest producer of NAND chips, which it values at $18 billion or more, to cover billions of dollars in cost overruns at its now-bankrupt U.S. nuclear business Westinghouse Electric.
Foxconn, however, has not been seen as a frontrunner for the unit due to its deep ties with China, where it manufactures much of its products. The Japanese government has said it will block any deal that would risk the transfer of key chip technology out of the country.
But Gou said that Foxconn-led consortium contained no Chinese capital and had the advantage of not inviting as much antitrust scrutiny as other suitors.
“The key is that we are all customers, we are users,” he said.
Foxconn, formally known as Hon Hai Precision Industry, and its Japanese unit Sharp would have a combined stake of not more than 40%, he added.
Representatives for Apple and the other U.S. firms named by Gou could not be immediately reached for comment outside of regular business hours. Sharp declined to comment.
Gou’s revelations of the Foxconn-led bid come as uncertainty
spikes over the make-up of the groups bidding in the hotly contest auction just days before Toshiba is due to announce a preferred bidder.
Western Digital plans to raise its offer for Toshiba’s semiconductor unit, a person familiar with the matter told Reuters over the weekend, in a last-ditch effort to clinch a deal.
The U.S. chipmaker is part of a consortium led by a Japanese government-backed fund and the group will present the new offer of 2 trillion yen ($18 billion) or more, the source said.
The laptops-to-nuclear conglomerate aims to name a winner for at a board meeting on June 15. Tokyo, however, has been asking Toshiba to postpone the decision as the government-led consortium has yet to finalize its proposal.
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Some sources have said that the state-backed fund, the Innovation Network of Japan, is also exploring a potential consortium with Bain Capital, though it is unclear what other firms would also be members of that group.
Western Digital has been seen by some sources as crucial to successful deal, as it jointly operates a key flash-memory chip plant with Toshiba in western Japan.
But Western Digital and Toshiba have been at loggerheads over the auction. Western Digital is pursuing an international arbitration claim that Toshiba has breached joint-venture contracts by entertaining outside bids.
Toshiba has favored a separate bid from U.S. chipmaker Broadcom, which has partnered with U.S. private equity firm Silver Lake to offer 2.2 trillion yen, people familiar with the matter have told Reuters.